Electronic Assembly Industry
Electronic devices and components are continuously evolving. New technologies combined with established manufacturing methods form today's electronic product innovations.
Manufacturing and design of components, printed circuit boards (PCB), surface mount assemblies, through hole assemblies, and complete electronic assemblies requires reliable materials, efficient processes and expert suppliers. Manufacturers and innovators must be able to deliver and support solutions that provide economic and technical advantages while meeting ever increasing performance requirements.
Expertise
COG Engineering combines years of experience creating and refining manufacturing processes with our expertise in material selection to provide proven improvements to a wide variety of products. We understand your requirements and have proven solutions. COG Engineering will help you consider multiple solutions to ruggedizing, thermal management, strain relieving, assembly operations, bonding, attachment, sealing and packaging. Our suppliers will help us identify the right materials to meet your performance criteria and COG will work with you to qualify materials and processes.
We will hep you consider critical design and materials criteria
- Material Costs
- Energy costs
- Environmental Impact
- Equipment Options
- Return on Investment
- Production Speed
- Thermal Cycling and Tg
- Thermal Expansion
- Fire Retardant
- UL Certification
- Electrical Insulation or Conductivity
- EFI Shielding
Electronic Applications
- Surface Mount Components - potting, UV potting, surface modification, packaging design, injection molding, automation
- Wireless Router - liquid gasket, EFI shielding, Encapsulation, design protection, water proofing, injection molding, housing design, strain relief, thermal management, pilot production
- Defence Technologies - potting, shock protection, alignment, bonding, coating, thermal management, assembly optimization
- Wire Harness - Insulation, assembly, electrical insulation, conductive epoxy, isolation, mechanical design, overmolding, potting
- GPS Display - Form in place gasket, optical bonding, strain relief, potting, insulating, water proofing, UV gaskets
Success Stories
UV Gasket
We visited a maquiladora in Baja manufacturing outdoor electronics used in the harsh marine environment. They were looking for ways to reduce costs and improve productivity. They were currently using silicone gaskets to seal several different models of their LCD display devices. Each model required a specific size gasket to be kept in inventory and placed by hand into each tongue and groove housing assembly. They had acquired UV curable materials from another vendor in an attempt to develop a Form in Place UV cured Gasket. While they were on the right track, the vendor had no experience or equipment knowledge and they had abandoned the idea. Within a week EMI UV had provided sample materials. With the help of local expert dispensing and UV equipment manufacturers we were able to demonstrate feasibility and estimate Return on Investment. Today this manufacturer stocks one liquid material for all gasket needs and a single operator loads parts. EMI and COG Engineering continue to support production on a regular basis. We are a resource for product development, troubel shooting, UV process training, safety audits and cost reduction efforts.
See video and more in our UV Gasket Case Study
Electronic Materials Incorporated (EMI) has over 15 years of experience formulating and manufacturing UV curable adhesive and epoxy systems for many different industries.
In addition to offering our complete line of EMCAST UV adhesives, epoxies, sealants, encapsulants and coatings, EMI also offers room temperature, thermal and visible light cure adhesive systems.
These materials can be Electrically & Thermally conductive systems, Surface mount adhesives, glob tops, and Chip Underfill materials. With custom formulating, packaging and application services, EMI can provide solutions to all of your adhesive applications.
EFI Polymers is a global supplier of potting compounds. Potting compounds are typically two-component systems that harden at room temperature or use heat to accelerate the curing process. Many of EFI's Potting Compounds are UL 1446 recognized for use up to 180C (Class H) or are UL 94 V0 and now UL 94 5VA listed for Flame Retardency. EFI's extensive line of Potting Compounds are formulated for a wide variety of properties from high thermal conductivity, low coefficient of expansion (CTE), High HDT, Low Tg, High dielectric strength and Low moisture absorption just to name a few - contact us for assistance with one of our Potting Compounds.